| http://dbpedia.org/ontology/abstract
|
Glass frit bonding, also referred to as gl … Glass frit bonding, also referred to as glass soldering or seal glass bonding, describes a wafer bonding technique with an intermediate glass layer. It is a widely used encapsulation technology for surface micro-machined structures, e.g., accelerometers or gyroscopes. This technique utilizes low melting-point glass ("glass solder") and therefore provides various advantages including that viscosity of glass decreases with an increase of temperature. The viscous flow of glass has effects to compensate and planarize surface irregularities, convenient for bonding wafers with a high roughness due to plasma etching or deposition. A low viscosity promotes hermetically sealed encapsulation of structures based on a better adaption of the structured shapes. Further, the coefficient of thermal expansion (CTE) of the glass material is adapted to silicon. This results in low stress in the bonded wafer pair. The glass has to flow and wet the soldered surfaces well below the temperature where deformation or degradation of either of the joined materials or nearby structures (e.g., metallization layers on chips or ceramic substrates) occurs. The usual temperature of achieving flowing and wetting is between 450 and 550 °C (840 and 1,020 °F). Glass frit bonding can be used for many surface materials, e.g., silicon with hydrophobic and hydrophilic surface, silicon dioxide, silicon nitride, aluminium, titanium or glass, as long as the CTE are in the same range. This bonding procedure also allows the realization of metallic feedthroughs to contact active structures in the hermetically sealed cavity. Glass frit as a dielectric material does not need additional passivation for preventing leakage currents at process temperatures up to 125 °C (257 °F). The process begins with the deposition of glass paste onto the surfaces to be treated. It is then heated to burn out additives and fire it in order to form the glass layer. The bonding process reconfigures the sintered glass into the desired state. Finally, the reconfigured glass is cooled down. Glass frit bonding is used to encapsulate surface micro-machined sensors, i.e. gyroscopes and accelerometers. Other applications are the sealing of absolute pressure sensor cavities, the mounting of optical windows and the capping of thermally active devices.d the capping of thermally active devices.
|
| http://dbpedia.org/ontology/thumbnail
|
http://commons.wikimedia.org/wiki/Special:FilePath/b-gf-crosssectionsembosch.png?width=300 +
|
| http://dbpedia.org/ontology/wikiPageID
|
31336130
|
| http://dbpedia.org/ontology/wikiPageLength
|
23896
|
| http://dbpedia.org/ontology/wikiPageRevisionID
|
1116156783
|
| http://dbpedia.org/ontology/wikiPageWikiLink
|
http://dbpedia.org/resource/Glass-to-metal_seal +
, http://dbpedia.org/resource/Redox +
, http://dbpedia.org/resource/Gyroscope +
, http://dbpedia.org/resource/Wafer_bonding +
, http://dbpedia.org/resource/Shearing_%28physics%29 +
, http://dbpedia.org/resource/Coefficient_of_thermal_expansion +
, http://dbpedia.org/resource/Dielectric_material +
, http://dbpedia.org/resource/Thermal_expansion +
, http://dbpedia.org/resource/Thermal_shock +
, http://dbpedia.org/resource/Solvent +
, http://dbpedia.org/resource/Thallium +
, http://dbpedia.org/resource/Glass +
, http://dbpedia.org/resource/Passivation_%28chemistry%29 +
, http://dbpedia.org/resource/Iron +
, http://dbpedia.org/resource/Filler_%28material%29 +
, http://dbpedia.org/resource/Hydrogen +
, http://dbpedia.org/resource/Aluminium +
, http://dbpedia.org/resource/Plasma_display +
, http://dbpedia.org/resource/Sealant +
, http://dbpedia.org/resource/Conductive +
, http://dbpedia.org/resource/Van_der_Waals_force +
, http://dbpedia.org/resource/Porosity +
, http://dbpedia.org/resource/Lead_glass +
, http://dbpedia.org/resource/Outgassing +
, http://dbpedia.org/resource/Glass-ceramic-to-metal_seal +
, http://dbpedia.org/resource/Failure_analysis +
, http://dbpedia.org/resource/Ink +
, http://dbpedia.org/resource/Electronic_packaging +
, http://dbpedia.org/resource/Category:Wafer_bonding +
, http://dbpedia.org/resource/Borosilicate_glass +
, http://dbpedia.org/resource/Diffusion_welding +
, http://dbpedia.org/resource/Vacuum_tube +
, http://dbpedia.org/resource/Titanium_dioxide +
, http://dbpedia.org/resource/Sulfur +
, http://dbpedia.org/resource/Arsenic +
, http://dbpedia.org/resource/Nitrocellulose +
, http://dbpedia.org/resource/Category:Packaging_%28microfabrication%29 +
, http://dbpedia.org/resource/Bismuth%28III%29_oxide +
, http://dbpedia.org/resource/Plasma_etching +
, http://dbpedia.org/resource/Viscosity +
, http://dbpedia.org/resource/Reverse_engineering +
, http://dbpedia.org/resource/MEMS +
, http://dbpedia.org/resource/Viscous_flow +
, http://dbpedia.org/resource/Optical_window +
, http://dbpedia.org/resource/Cordierite +
, http://dbpedia.org/resource/Hydrophobic +
, http://dbpedia.org/resource/Adhesive +
, http://dbpedia.org/resource/Glass_transition +
, http://dbpedia.org/resource/Leakage_current +
, http://dbpedia.org/resource/Hermetic_seal +
, http://dbpedia.org/resource/Sintering +
, http://dbpedia.org/resource/Evacuated_glazing +
, http://dbpedia.org/resource/Feedthrough +
, http://dbpedia.org/resource/Kiln +
, http://dbpedia.org/resource/Phosphate_glass +
, http://dbpedia.org/resource/Lead%28II%29_oxide +
, http://dbpedia.org/resource/Barium_silicate +
, http://dbpedia.org/resource/Geiger_tube +
, http://dbpedia.org/resource/Microelectromechanical_systems +
, http://dbpedia.org/resource/Pottery_firing +
, http://dbpedia.org/resource/Glass-ceramic +
, http://dbpedia.org/resource/Stress_%28mechanics%29 +
, http://dbpedia.org/resource/Window +
, http://dbpedia.org/resource/Titanium +
, http://dbpedia.org/resource/Category:Semiconductor_technology +
, http://dbpedia.org/resource/Covalent_bond +
, http://dbpedia.org/resource/Phosphorus_pentoxide +
, http://dbpedia.org/resource/Screen_printing +
, http://dbpedia.org/resource/Bake-out +
, http://dbpedia.org/resource/Silicon_dioxide +
, http://dbpedia.org/resource/Frit +
, http://dbpedia.org/resource/Reliability_%28semiconductor%29 +
, http://dbpedia.org/resource/Bismuth_trioxide +
, http://dbpedia.org/resource/Borate +
, http://dbpedia.org/resource/Photolithography +
, http://dbpedia.org/resource/Hydrophilic +
, http://dbpedia.org/resource/Binder_%28material%29 +
, http://dbpedia.org/resource/Vapor_deposition +
, http://dbpedia.org/resource/Zinc_oxide +
, http://dbpedia.org/resource/Accelerometer +
, http://dbpedia.org/resource/Copper%28II%29_oxide +
, http://dbpedia.org/resource/Spin_coating +
, http://dbpedia.org/resource/Silicon +
, http://dbpedia.org/resource/Borate_glass +
, http://dbpedia.org/resource/Lead +
, http://dbpedia.org/resource/Aluminium_oxide +
, http://dbpedia.org/resource/Eutectic +
, http://dbpedia.org/resource/Devitrification +
, http://dbpedia.org/resource/Cathode_ray_tube +
, http://dbpedia.org/resource/Wettability +
, http://dbpedia.org/resource/Silicon_nitride +
, http://dbpedia.org/resource/Vacuum +
, http://dbpedia.org/resource/Wetting +
, http://dbpedia.org/resource/Filler_%28materials%29 +
, http://dbpedia.org/resource/Category:Electronics_manufacturing +
, http://dbpedia.org/resource/Lead-free +
, http://dbpedia.org/resource/Pressure_sensor +
, http://dbpedia.org/resource/CERDIP +
, http://dbpedia.org/resource/Anodic_bonding +
, http://dbpedia.org/resource/Integrated_circuit +
|
| http://dbpedia.org/property/caption
|
Bosch
, Fraunhofer IZM
|
| http://dbpedia.org/property/header
|
Microscopic cross sectional SEM images of glass frit bonded silicon wafers
|
| http://dbpedia.org/property/image
|
b-gf-crosssectionsemizm.png
, b-gf-crosssectionsembosch.png
|
| http://dbpedia.org/property/wikiPageUsesTemplate
|
http://dbpedia.org/resource/Template:Refs +
, http://dbpedia.org/resource/Template:Wafer_bonding +
, http://dbpedia.org/resource/Template:Cvt +
, http://dbpedia.org/resource/Template:Multiple_images +
, http://dbpedia.org/resource/Template:Convert +
, http://dbpedia.org/resource/Template:Cn +
|
| http://purl.org/dc/terms/subject
|
http://dbpedia.org/resource/Category:Electronics_manufacturing +
, http://dbpedia.org/resource/Category:Packaging_%28microfabrication%29 +
, http://dbpedia.org/resource/Category:Wafer_bonding +
, http://dbpedia.org/resource/Category:Semiconductor_technology +
|
| http://www.w3.org/ns/prov#wasDerivedFrom
|
http://en.wikipedia.org/wiki/Glass_frit_bonding?oldid=1116156783&ns=0 +
|
| http://xmlns.com/foaf/0.1/depiction
|
http://commons.wikimedia.org/wiki/Special:FilePath/b-gf-crosssectionsemizm.png +
, http://commons.wikimedia.org/wiki/Special:FilePath/b-gf-crosssectionsembosch.png +
|
| http://xmlns.com/foaf/0.1/isPrimaryTopicOf
|
http://en.wikipedia.org/wiki/Glass_frit_bonding +
|
| owl:sameAs |
https://global.dbpedia.org/id/4kbDo +
, http://dbpedia.org/resource/Glass_frit_bonding +
, http://rdf.freebase.com/ns/m.0gkzy_r +
, http://www.wikidata.org/entity/Q5567109 +
|
| rdfs:comment |
Glass frit bonding, also referred to as gl … Glass frit bonding, also referred to as glass soldering or seal glass bonding, describes a wafer bonding technique with an intermediate glass layer. It is a widely used encapsulation technology for surface micro-machined structures, e.g., accelerometers or gyroscopes. This technique utilizes low melting-point glass ("glass solder") and therefore provides various advantages including that viscosity of glass decreases with an increase of temperature. The viscous flow of glass has effects to compensate and planarize surface irregularities, convenient for bonding wafers with a high roughness due to plasma etching or deposition. A low viscosity promotes hermetically sealed encapsulation of structures based on a better adaption of the structured shapes. Further, the coefficient of thermal expansFurther, the coefficient of thermal expans
|
| rdfs:label |
Glass frit bonding
|
