http://dbpedia.org/resource/Wafer-level_packaging +
, http://dbpedia.org/resource/Quad_flat_package +
, http://dbpedia.org/resource/Integrated_circuit_packaging +
, http://dbpedia.org/resource/Chip_carrier +
, http://dbpedia.org/resource/Flatpack_%28electronics%29 +
, http://dbpedia.org/resource/Dye-and-pry +
, http://dbpedia.org/resource/Flat_no-leads_package +
, http://dbpedia.org/resource/Universal_integrated_circuit_card +
, http://dbpedia.org/resource/Through-hole_technology +
, http://dbpedia.org/resource/Mini-Cartridge +
, http://dbpedia.org/resource/Chip-scale_package +
, http://dbpedia.org/resource/Thin_Quad_Flat_Pack +
, http://dbpedia.org/resource/Cerquad +
, http://dbpedia.org/resource/XSON +
, http://dbpedia.org/resource/Zig-zag_in-line_package +
, http://dbpedia.org/resource/Land_grid_array +
, http://dbpedia.org/resource/Package_on_a_package +
, http://dbpedia.org/resource/Small_outline_integrated_circuit +
, http://dbpedia.org/resource/List_of_integrated_circuit_packaging_types +
, http://dbpedia.org/resource/Multi-chip_module +
, http://dbpedia.org/resource/Ball_grid_array +
, http://dbpedia.org/resource/Quad_in-line_package +
, http://dbpedia.org/resource/Copper%E2%80%93tungsten +
, http://dbpedia.org/resource/Thin_small_outline_package +
, http://dbpedia.org/resource/Surface-mount_technology +
, http://dbpedia.org/resource/Flip_chip +
, http://dbpedia.org/resource/Solid_Logic_Technology +
, http://dbpedia.org/resource/Low_insertion_force +
, http://dbpedia.org/resource/Multi-leaded_power_package +
, http://dbpedia.org/resource/Electronic_packaging +
, http://dbpedia.org/resource/Dual_in-line_package +
, http://dbpedia.org/resource/Pin_grid_array +
, http://dbpedia.org/resource/Fan-out_wafer-level_packaging +
, http://dbpedia.org/resource/E-Material +
, http://dbpedia.org/resource/AlSiC +
, http://dbpedia.org/resource/Dymalloy +
, http://dbpedia.org/resource/Embedded_wafer_level_ball_grid_array +
|
http://dbpedia.org/ontology/wikiPageWikiLink
|
http://dbpedia.org/resource/Wafer-level_packaging +
, http://dbpedia.org/resource/Quad_flat_package +
, http://dbpedia.org/resource/Integrated_circuit_packaging +
, http://dbpedia.org/resource/Chip_carrier +
, http://dbpedia.org/resource/Flatpack_%28electronics%29 +
, http://dbpedia.org/resource/Dye-and-pry +
, http://dbpedia.org/resource/Flat_no-leads_package +
, http://dbpedia.org/resource/Universal_integrated_circuit_card +
, http://dbpedia.org/resource/Through-hole_technology +
, http://dbpedia.org/resource/Mini-Cartridge +
, http://dbpedia.org/resource/Chip-scale_package +
, http://dbpedia.org/resource/Thin_Quad_Flat_Pack +
, http://dbpedia.org/resource/Cerquad +
, http://dbpedia.org/resource/XSON +
, http://dbpedia.org/resource/Zig-zag_in-line_package +
, http://dbpedia.org/resource/Land_grid_array +
, http://dbpedia.org/resource/Package_on_a_package +
, http://dbpedia.org/resource/Small_outline_integrated_circuit +
, http://dbpedia.org/resource/List_of_integrated_circuit_packaging_types +
, http://dbpedia.org/resource/Multi-chip_module +
, http://dbpedia.org/resource/Ball_grid_array +
, http://dbpedia.org/resource/Quad_in-line_package +
, http://dbpedia.org/resource/Copper%E2%80%93tungsten +
, http://dbpedia.org/resource/Thin_small_outline_package +
, http://dbpedia.org/resource/Surface-mount_technology +
, http://dbpedia.org/resource/Flip_chip +
, http://dbpedia.org/resource/Solid_Logic_Technology +
, http://dbpedia.org/resource/Low_insertion_force +
, http://dbpedia.org/resource/Multi-leaded_power_package +
, http://dbpedia.org/resource/Electronic_packaging +
, http://dbpedia.org/resource/Dual_in-line_package +
, http://dbpedia.org/resource/Pin_grid_array +
, http://dbpedia.org/resource/Fan-out_wafer-level_packaging +
, http://dbpedia.org/resource/E-Material +
, http://dbpedia.org/resource/AlSiC +
, http://dbpedia.org/resource/Dymalloy +
, http://dbpedia.org/resource/Embedded_wafer_level_ball_grid_array +
, http://dbpedia.org/resource/Lead_frame +
|
http://purl.org/dc/terms/subject
|
http://dbpedia.org/resource/Category:Chip_carriers +
|
owl:sameAs |