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Airgap is a technique invented by IBM for fabricating small pockets of vacuum in between copper interconnects. The technique belongs to a general class of similar techniques that replaces solid low-κ dielectrics with air-filled or vacuum pockets.
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https://arstechnica.com/news.ars/post/20070503-ibms-catches-air-touts-top-ten-list.html +
, http://www-03.ibm.com/press/us/en/pressrelease/21473.wss +
, http://news.bbc.co.uk/2/hi/technology/6618919.stm +
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| rdfs:comment |
Airgap is a technique invented by IBM for fabricating small pockets of vacuum in between copper interconnects. The technique belongs to a general class of similar techniques that replaces solid low-κ dielectrics with air-filled or vacuum pockets.
|
| rdfs:label |
IBM airgap
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