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Https://dblp.org/rec/journals/sensors/KimYKCL23
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https://dblp.org/rec/journals/sensors/KimYKCL23
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https://dblp.org/rdf/schema#publishedInJournalVolume 23
https://dblp.org/rdf/schema#publishedInJournalVolumeIssue 14
https://dblp.org/rdf/schema#title Fabrication and Characterization of Three-Dimensional Microelectromechanical System Coaxial Socket Device for Semiconductor Package Testing.
https://dblp.org/rdf/schema#yearOfPublication 2023
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rdfs:label Tae-Kyun Kim et al.: Fabrication and Characterization of Three-Dimensional Microelectromechanical System Coaxial Socket Device for Semiconductor Package Testing. (2023)
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