| https://dblp.org/rdf/schema#authoredBy
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https://dblp.org/pid/285/7870 +
, https://dblp.org/pid/119/7944 +
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, https://dblp.org/pid/34/10151 +
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http://purl.org/net/nknouf/ns/bibtex#Article +
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https://dblp.org/pid/285/7870 +
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, https://dblp.org/pid/285/8006 +
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|
https://doi.org/10.1016/J.MICROREL.2017.02.018 +
|
| https://dblp.org/rdf/schema#doi
|
https://doi.org/10.1016/J.MICROREL.2017.02.018 +
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https://dblp.org/db/journals/mr/mr71 +
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5
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| https://dblp.org/rdf/schema#pagination
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71-81
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| https://dblp.org/rdf/schema#primaryDocumentPage
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https://doi.org/10.1016/J.MICROREL.2017.02.018 +
|
| https://dblp.org/rdf/schema#publishedIn
|
Microelectron. Reliab.
|
| https://dblp.org/rdf/schema#publishedInJournal
|
Microelectron. Reliab.
|
| https://dblp.org/rdf/schema#publishedInJournalVolume
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71
|
| https://dblp.org/rdf/schema#publishedInStream
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https://dblp.org/streams/journals/mr +
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| https://dblp.org/rdf/schema#title
|
Numerical simulations of migration and coalescence behavior of microvoids driven by diffusion and electric field in solder interconnects.
|
| https://dblp.org/rdf/schema#yearOfPublication
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2017
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https://doi.org/10.1016/J.MICROREL.2017.02.018 +
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https://dblp.org/rdf/schema#Publication +
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Shuibao Liang et al.: Numerical simulations of migration and coalescence behavior of microvoids driven by diffusion and electric field in solder interconnects. (2017)
|
